Apple to delay 2nm chips for 2026 as TSMC struggles with yield

Apple was reportedly looking to launch the iPhone 17 Pro in 2025 with a 2nm chipset, but it might have to delay its plans by 12 months, according to reports from South Korea.

The latest information from insiders claimed that TSMC is struggling with wafer yield, and the 2nm chips have yet to be certified for mass production. There is too much demand for test products, and the Taiwanese maker is pushed to adapt its existing facilities for the new process, which will take time.

TSMC exclusively produces chips for Apple devices like iPhones and MacBooks, but the Taiwanese firm also serves other prominent clients like Nvidia and Qualcomm. Allegedly, these two companies are in talks with Samsung Electronics to expand production to Korean foundries if tensions in Taiwan worsen.

TSMC currently manufactures 10,000 wafers monthly, with plans to expand to 80,000 by 2026. Its facility in Arizona will contribute to achieving a total production capacity of 140,000.

TSMC semiconductor manufacturing fab site in Phoenix, Arizona

Taiwan's Economic Daily reported that the yield for 2nm wafers is at 60%, indicating that 40% of each wafer is unusable. With the production cost for one wafer at KRW 44 million (approximately $30,000), TSMC effectively loses $120 million monthly due to the imperfections of the new process.

The solution is straightforward – Apple will continue using a 3 nm process for another year, allowing TSMC to enhance yield and improve pricing. Samsung faces challenges as well – the South Korean company needs to boost both the yield and performance of its 2 nm chips, which are already falling short compared to its major Taiwanese rival.

Source (in Korean)