According to @evleaks, the previously leaked HTC One A9 will feature a mid-range Qualcomm Snapdragon 617 chipset. The smartphone is expected to make its official debut at the end of this month, on September 29 alongside HTC Butterfly 3.
The rest of the One A9’s specs include 2GB of RAM, 16GB of expandable memory, 13MP main camera with OIS, and 4MP front-facing snapper. A 5” 1080p AMOLED display, 2,150mAh battery, and fingerprint sensor are also said to be on board.
There is no mention of the Android build on board of the device by @evleaks. However, earlier today, a word got out that the device might run Android Marshmallow out of the box.
HTC One A9 will allegedly have a metal body that’s around 7mm thin. The handset is tipped to hit the shelves in November in six color schemes.
Seriously, companies are out of their minds now. Putting smaller and smaller batteries and trying to make thinner phone. It seems like aesthetics are only thing they care about now. What will we do with a phone wafer thin?
You took the words right out of my mouth. The excitement is not longer a factor!
I thought they considered the last of their Butterfly as one of their flagship too