Kirin 985 to be mass-produced with 5G modems

Last month we heard rumors that the Huawei Mate 30 could be the first smartphone with a chipset built on the EUV process, and now media representatives in Taiwan confirm the information. Not only that, but Huawei’s chip manufacturer HiSilicon will implement 5G modem in all the chips, effectively making all future Huawei flagships 5G-compatible.

The new processor will be manufactured using the FC-PoP method (FlipChip Package-on-Package), which allows vertical stacking of transistors. Combined with the Extreme UltraViolet process, the transistor density will be increased by 20% - this means better chip performance and lower energy consumption.

Manufacturing will begin in the third quarter of 2019 in order for Huawei to be ready with its smartphones in October - that’s when the new Mates usually hit the market. Sources also say Huawei is aiming to compete with the next-gen Apple A13 processor and is trying to implement the integrated fan-out package (InFO), that allows for a higher number of contacts without increasing the die size.

Source (in Chinese)