The next-gen technology - dubbed Snapdragon Sense ID - was unveiled by Qualcomm back in March last year. It relies on ultrasonic 3D scanning and works through all kind of surfaces including glass, sapphire, metal, aluminum, and plastic.
The tech allows smartphone manufactures to embed the sensors within frames or panels, instead of a dedicated place like it is the case today. For example, if the sensor is positioned under the device's front glass panel, you will be able to unlock the phone by touching anywhere on the screen.
It will be interesting to see how - if at all - the Chinese company will use the technology in the Mi 5S.
The handset - which already cleared the Chinese 3C regulatory body - will be powered by Snapdragon 821 chipset, and sport a 5.15-inch display. Other specs include 6GB RAM, 256GB storage, 16MP rear camera, and 3,490mAh battery.
Really? I really like it.. prefer it over LCD actually.
-Sense ID is a platform, not a sensor (when will people learn!) -A few month ago the ultrasonic sucked big time in the leeco phone. -would xiaomi put this in their flagship 6 month later? -fingerprint cards has a fully working under glass senso...