Mediatek announced the Dimensity 1050 - its first chipset with mmWave 5G support. It will allow seamless connectivity through an easy switch between the Sub-6GHz and the mmWave standards. It is built by TSMC on a 6nm process, and the company promised devices with the chip as early as Q3 2022.
The Taiwanese company also introduced its Wi-Fi 7 platforms in the Filogic 880 and Filogic 380 with Wi-Fi 7 and Bluetooth 5.3 integration.
Dimensity 1050 has an octa-core CPU - two Cortex-A78 units at 2.5 GHz and six Cortex-A55 at 2.0 GHz - and a Mali-G610 MC3 GPU. The mmWave comes with 4CC carrier aggregation, while Sub-6 is limited to 3CC.
Finally, Mediatek brought to the stage two additional chips to power the lower mid-range phones of tomorrow. One is Dimensity 930 with faster connectivity than the 920 and support for 120Hz Full HD+ displays with HDR10+. The second is Helio G99, which is an evolution of the LTE-only Helio G96, built on the 6nm platform, instead of 12nm.
Your point can also apply on the CPU inside the D1050: remember the D1050 has 2x A78 + 6x A55 configuration, versus 4x A76 + 4x A55 in the 800 and 1000. Best case scenario, it would perform just as good while offering major power savings, but I bet m...
no and yes. Dimensity 1050 have stronger a78 cpu cores. I hope the 1050's gpu will be stroger than 1000's. Dimensity 1050's Mali G610 is strong, but how will it compete to mali g77 mc9(9 cores) to mali g610 mc3(3 cores)