MediaTek today announced the Dimensity 810 SoC, and it looks like Realme will be the first brand to launch a device powered by that chipset.
Realme India and Europe's CEO, Mr. Madhav Sheth, retweeted MediaTek's post about the Dimensity 810 and asked if customers and fans would like the phone maker to be the first to bring a Dimensity 810-powered device to the market, basically calling dibs on the Taiwanese company's freshly announced chip.
While Mr. Sheth didn't divulge anything about Realme's Dimensity 810-powered smartphone, the device in question is likely the Realme 8s that leaked last month.
The report claimed that Realme 8s will pack a 6.5" 90Hz screen, although it didn't reveal the panel's type and resolution and whether it will have a punch hole or a notch.
We did get to see the rear side of the 8s, though, sporting a rectangular island with a flash and three cameras inside. The primary camera uses a 64MP sensor, but we have no information about the other two units.
For selfies and video calls, the 8s is said to have a 16MP unit, and under the hood will be a 5,000 mAh battery with 33W charging.
The Realme 8s will run Android 11-based Realme UI 2.0 out of the box and have two RAM options - 6GB and 8GB. It will also come with the virtual RAM expansion feature called Dynamic RAM Expansion (DRE) in Realme's realms.
The 8s will have 128GB or 256GB storage options, support 5G connectivity, and feature a side-mounted fingerprint reader, 3.5mm headphone jack, and USB-C port.
The camera section will drastically improve in the Dimensity 810.
(you mean software+firmware which is thoroughly tested before release and vendor which take time to fix bugs.... Rather than releasing monthly update with new bugs) > hardware