Entry-level smartphones are going to get even smarter with the three new platforms Qualcomm just unveiled. The Snapdragon 632, Snapdragon 439, and Snapdragon 429 chipsets promise increased CPU and graphics performance as well as improved power efficiency. All of them will have AI capabilities and support for various mobile payment systems.
The highlight of the announcement is that the Snapdragon 632, which is built on the 14 nm FinFET process, while the two 400-series platforms will be on the 12 nm wafer. Kedar Kondap, Product Manager and VP at Qualcomm, said that over 1,350 devices run the 600-tier platforms and 2,300 more are on the 400-series. The three new chips are expected to bring significant improvements and enhanced features to OEMs and users, Kondap added.
|Snapdragon 632||Snapdragon 439||Snapdragon 429|
|Process||14 nm (FinFET)||12 nm (FinFET)||12 nm (FinFET)|
|CPU||8x Kryo 250 (1.8 GHz)||8x Cortex-A53 (1.95 GHz)||4x Cortex-A53 (1.95 GHz)|
|GPU||Adreno 506||Adreno 505||Adreno 504|
|Camera||Up to 24MP / 13MP + 13 MP||Up to 21MP / 8MP + 8MP||Up to 16MP / 8MP + 8MP|
|Video||4K @ 30fps / 1080p @ 60fps||1080p @ 30fps||1080p @ 30fps|
|Max screen res||Full HD+||Full HD+||HD+|
|LTE||300Mbps / 100Mbps||150Mbps / 75Mbps||150Mbps / 75Mbps|
|Wi-Fi||802.11ac (364Mbps)||802.11ac (364Mbps)||802.11ac (364Mbps)|
Snapdragon 632, 439, and 429 are software compatible with the 626, 625, and 450. The 439 and 429 are even pin-compatible for quick upgrades should manufacturers decide to go that way.
Qualcomm promises devices with the new SoC will start to appear in the H2 2018, so we’ll have an even more diverse chipset landscape by the end of the year.
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