Qualcomm is partnering with BOE to produce flexible panels with 3D Sonic sensors
Qualcomm has just announced its partnership with BOE - one of the world's largest LCD and OLED manufacturers and one of the few flexible display makers. The partnership should enable BOE to manufacture flexible OLED panels with integrated 3D Sonic fingerprint sensors.
With Qualcomm partnering with BOE, they intend to sell complete solutions to smartphone manufacturers, bringing the cost down for OEMs and offer customized and much easier integration to custom designs. Phone manufacturers won't be dealing with the entire research and development process.
The announcement says that we can expect consumer-ready devices with this combo in the second half of this year. Moreover, the Qualcomm - BOE partnership will extend beyond just smartphone panels since both companies are interested in developing IoT systems together.
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Reader comments
- AnonD-909757
- 3g5
Nah, most of my comments are really long, sometime I even exceed the character limits and need to post in two parts xD But thanks that's highly appreciated, don't worry about not reading it, to summarize my comment : Ultrasonic fingerprint ...
- Adoogle
- 39x
Please accept my apologies for not having read your comment yet, though I shall in due course. I simply had to commend you on possibly the longest (and in all likelihood factually-rich and wholesome) comment posted on GSMare
Translation: things are going rough between Qualcomm and Samsung, over their ultrasonic FP implementation. Moreover BOE panels feature everywhere, as a cheap Samsung alternative, especially in cheaper Chinese flagships/normal phones. So if Qualcomm b...
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